Shenzhen Xindong Technology Co., Ltd

The company operates under the Smart IDM model, focusing on the design, device development, production, sales, and application services of next-generation power semiconductor chips. It is committed to providing high-reliability, high-performance discrete devices, modules, and board-level solutions in industries such as new energy vehicles, computing power, energy storage, wind power, and industrial drives. Its products include third-generation semiconductor Silicon Carbide (SiC) MOSFETs and modules in the voltage range of 600V to 2000V, Silicon-based Super Junction (SJ) MOSFETs, IGBT discrete devices and modules, new integrated power chips, and board-level system solutions.

The company has a mature mass production process for SiC MOSFETs and IGBT ultra-thin wafer backside technology, with performance and parameters on PAR with international products. In the chip manufacturing value chain, the company provides a "one-stop FSM+BGBM" solution for the back-end process, benchmarked against international leading technologies. Customized backside metal and thinning processes are offered to ensure high performance, cost-effectiveness, and enhanced product competitiveness.