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Miss Aria. Chu
Address:
No. 1519, Xinghai South Road, Zhuangshi Street, Zhenhai District, Shenzhen, Guangdong, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2024
Business Range:
Electrical & Electronics
Management System Certification:
ISO 9000
Business Type:
Trading Company
Main Products:
IGBT, IGBT Module, Mosfet, Sic Mosfet, Sj Mosfet, Diode, Sic Diode
Company Introduction
Trade Capacity
The company operates under the Smart IDM model, focusing on the design, device development, production, sales, and application services of next-generation power semiconductor chips. It is committed to providing high-reliability, high-performance discrete devices, modules, and board-level solutions in industries such as new energy vehicles, computing power, energy storage, wind power, and ...
The company operates under the Smart IDM model, focusing on the design, device development, production, sales, and application services of next-generation power semiconductor chips. It is committed to providing high-reliability, high-performance discrete devices, modules, and board-level solutions in industries such as new energy vehicles, computing power, energy storage, wind power, and industrial drives. Its products include third-generation semiconductor Silicon Carbide (SiC) MOSFETs and modules in the voltage range of 600V to 2000V, Silicon-based Super Junction (SJ) MOSFETs, IGBT discrete devices and modules, new integrated power chips, and board-level system solutions.
The company has a mature mass production process for SiC MOSFETs and IGBT ultra-thin wafer backside technology, with performance and parameters on PAR with international products. In the chip manufacturing value chain, the company provides a "one-stop FSM+BGBM" solution for the back-end process, benchmarked against international leading technologies. Customized backside metal and thinning processes are offered to ensure high performance, cost-effectiveness, and enhanced product competitiveness.
The company has a mature mass production process for SiC MOSFETs and IGBT ultra-thin wafer backside technology, with performance and parameters on PAR with international products. In the chip manufacturing value chain, the company provides a "one-stop FSM+BGBM" solution for the back-end process, benchmarked against international leading technologies. Customized backside metal and thinning processes are offered to ensure high performance, cost-effectiveness, and enhanced product competitiveness.
International Commercial Terms(Incoterms):
EXW, FAS
Terms of Payment:
LC, T/T, D/P, Western Union, Small-amount payment, Money Gram
Number of Foreign Trading Staff:
1~3 People
Export Year:
2024-12-13
Export Percentage:
1%~10%
Main Markets:
Western Europe
Nearest Port:
Yantian Port
Shekou Port
Dachan Bay Port
Shekou Port
Dachan Bay Port
Import & Export Mode:
Have Own Export License